JPH0547465Y2 - - Google Patents
Info
- Publication number
- JPH0547465Y2 JPH0547465Y2 JP3306689U JP3306689U JPH0547465Y2 JP H0547465 Y2 JPH0547465 Y2 JP H0547465Y2 JP 3306689 U JP3306689 U JP 3306689U JP 3306689 U JP3306689 U JP 3306689U JP H0547465 Y2 JPH0547465 Y2 JP H0547465Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- chip
- tape
- table board
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 30
- 238000005192 partition Methods 0.000 claims description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3306689U JPH0547465Y2 (en]) | 1989-03-22 | 1989-03-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3306689U JPH0547465Y2 (en]) | 1989-03-22 | 1989-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02122442U JPH02122442U (en]) | 1990-10-08 |
JPH0547465Y2 true JPH0547465Y2 (en]) | 1993-12-14 |
Family
ID=31259705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3306689U Expired - Lifetime JPH0547465Y2 (en]) | 1989-03-22 | 1989-03-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0547465Y2 (en]) |
-
1989
- 1989-03-22 JP JP3306689U patent/JPH0547465Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02122442U (en]) | 1990-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH03104300A (ja) | Ic実装装置及びその方法 | |
WO2002025720A1 (en) | Chip mounting device and calibration method therein | |
JPS6212679B2 (en]) | ||
JPH0547465Y2 (en]) | ||
JP2760547B2 (ja) | チップボンディング装置 | |
JP2847801B2 (ja) | 電子部品装着装置 | |
JP2617526B2 (ja) | ダイボンディング装置 | |
JPS59186334A (ja) | ボンデイング装置 | |
JP2633631B2 (ja) | 電子部品の実装装置 | |
JPS62199322A (ja) | 部品装着装置 | |
JPS60262433A (ja) | ボンデイング装置 | |
JPH10313013A (ja) | ボンディング装置及びボンディング方法並びに半導体装置の製造方法 | |
JPH0682227A (ja) | 電子部品の外観検査方法及びその装置 | |
JP2841683B2 (ja) | Ic実装方法及びその装置 | |
JPS60263942A (ja) | 防塵膜装着装置 | |
JP2921164B2 (ja) | リードのボンディング装置 | |
JP4343009B2 (ja) | 電子部品実装装置、当該装置におけるテーブル駆動領域制御方法、及び駆動テーブルの制御装置 | |
JP2000183114A (ja) | ボンディング装置 | |
JPH0632682Y2 (ja) | ボンディング装置の基板固定用受台 | |
JP2550384Y2 (ja) | Icカード用冷却装置 | |
JPH0120701Y2 (en]) | ||
JP2945080B2 (ja) | 電子部品装着装置及び電子部品装着方法 | |
JPH0636593Y2 (ja) | 複合集積回路装置 | |
JPH0810188Y2 (ja) | ボンディング装置 | |
JPH0323349U (en]) |